JPH085579Y2 - 薄膜配線基板 - Google Patents
薄膜配線基板Info
- Publication number
- JPH085579Y2 JPH085579Y2 JP1990011676U JP1167690U JPH085579Y2 JP H085579 Y2 JPH085579 Y2 JP H085579Y2 JP 1990011676 U JP1990011676 U JP 1990011676U JP 1167690 U JP1167690 U JP 1167690U JP H085579 Y2 JPH085579 Y2 JP H085579Y2
- Authority
- JP
- Japan
- Prior art keywords
- ground plane
- wiring board
- insulating layer
- film wiring
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 description 10
- 238000004528 spin coating Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011676U JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011676U JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03102766U JPH03102766U (en]) | 1991-10-25 |
| JPH085579Y2 true JPH085579Y2 (ja) | 1996-02-14 |
Family
ID=31515197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011676U Expired - Lifetime JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085579Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015083216A1 (ja) * | 2013-12-02 | 2015-06-11 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4494714B2 (ja) * | 2002-12-27 | 2010-06-30 | 東北リコー株式会社 | プリント配線板 |
| JP4798483B2 (ja) * | 2005-10-24 | 2011-10-19 | 住友ベークライト株式会社 | 回路基板 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59119797A (ja) * | 1982-12-25 | 1984-07-11 | 京セラ株式会社 | 多層配線基板 |
| JPS60211897A (ja) * | 1984-04-05 | 1985-10-24 | 日本電気株式会社 | 多層配線基板 |
| JPS6423598A (en) * | 1987-07-20 | 1989-01-26 | Sony Corp | Multilayer circuit board |
| JPS6482694A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | Wiring substrate |
-
1990
- 1990-02-08 JP JP1990011676U patent/JPH085579Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015083216A1 (ja) * | 2013-12-02 | 2015-06-11 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
| JPWO2015083216A1 (ja) * | 2013-12-02 | 2017-03-16 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03102766U (en]) | 1991-10-25 |
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